Table of Contents
Can you Desolder with a soldering iron?
Soldering Iron: A soldering iron supplies the heat that melts the solder. It consists of a tip, which you apply to the metal parts you want to solder together, and an insulated handle so that you can hold the iron.
How do I fix my BGA?
What are the steps of BGA repair?
- First, remove the components, such as the PCB.
- Next, remove the residual solder.
- Once you have removed all the excess solder, the BGA can be reballed.
- After the excess solder has been removed and the BGA has been reballed, the components and PCB can be re-soldered and reattached.
What is low melt solder?
These alloys are frequently called “fusible” alloys because they are easily melted at a relatively low temperature compared to most solder alloys. These alloys are made from two or more of the following elements: Bismuth, Tin, Lead, Cadmium, and Indium.
Can you weld metal with a soldering iron?
You cannot weld metals with a soldering iron. The melting points of most metals are much higher than your usual solder alloy and soldering irons cannot generate the heat to weld them. But plastics with low melting points can be theoretically welded with a soldering iron.
How do I Desolder without a soldering iron?
You can use anything that is able to heat a piece of metal up to the melting point of your solder (between 400°F / 200°C and 700°F / 370°C). Butane lighters work the best. But you can also use candles, oil lamps, alcohol burners, or even open camp fires.
Can you solder IC chip?
Any SMD IC that has pins or pads that you can see, you can solder. You can only solder parts with exposed pins or pads with a standard soldering iron. Parts with ball grid arrays (BGA) or hidden pads under the chip can’t be soldered with a regular soldering iron. You need a reflow oven to do them.
What is soldering flux used for?
The main purpose of the flux is to prepare the metal surfaces for soldering by cleaning and removing any oxides and impurities. Oxides are formed when metal is exposed to air and may prevent the formation of good solder joints.
How to solder between the BGA and main board?
The height between the BGA and the main board is only a few mils, much too small to get a solder iron between and unsolder the 200-300 joints at the same time. Unsoldering is usually done with hot air directed between the layers where the solder is.
Is it possible to solder a chip back to the board?
No. Depending on the chip the extra length of wire may cause issues especially with high frequency signals. Since you want to solder the chip back in place on the board, the amount of tinning and solder you add to the board and chip is crucial to ensure no shorts no cracks no uneven heating.
How can I remove a part from a soldered motherboard?
You might be able to get the part off by placing it in an oven at a temperature above the melting point of the solder, but then every other part on the board would become liquid solder as well and may fall off or get moved from their precise location.
How do I re-ball a BGA?
You can’t afford re-balling, plus you will need to develop a PCB interposer for the BGA with breakout pins, etc. Best way would be to use a very thin magnet wire, AWG36 to AWG40, and break the connection to some DIP-40 socket, or something. Solder 60/40 would be just fine, if you have a 10X stereo stand and fine-tip soldering iron.